Process Monitoring Information
Tystar Process Monitoring
Lam Process Monitoring
CPA Process Monitoring
Photoresist Thickness Monitoring
Tystar Process Monitoring
Tystar9 MOS Clean Silicon Nitride (Si3N4) LPCVD Furnaces (4" and 6")
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Tylan 11, LPCVD Poly
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Resistivity
Tylan 12, LPCVD Oxide
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Dopant Concentration
Tylan 16, LPCVD Poly
Current Process Monitoring Results
.
Statistical Process Control graph for Deposition Rates
Tylan 18, LPCVD Low-Stress Nitride
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Film Stress
Tylan 20, LPCVD Oxide
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Dopant Concentration
Get old process monitoring results
here
.
Go back to the
top.
Tylan Projects
The
Tylan 9 characterization project
was done to see what effects changes in the temperature, pressure, and gas flows would have on the deposition rate and uniformities.
The
Tylan 16 open/closed boat comparison
was performed to see what the consequence of using an open boat would be.
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top.
Lam Process Monitoring
Current data for
Lam 1
, Nitride Plasma Etching.
Current data for
Lam 2
, Oxide Plasma Etching.
Current data for
Lam 3
, Aluminum Plasma Etching.
Current data for
Lam 4
, Poly-Silicon Plasma Etching.
Get old Lam results
here
.
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top.
CPA Process Monitoring
Current data for the
CPA
Get old CPA results
here
Go back to the
top.
Photoresist Thickness Monitoring
Process Monitoring Graphs for OCG G-Line Resist
Average Resist
Thickness
Resist Thickness
Range
Resist Thickness
Uniformity
Process Monitoring Graphs for OCG I-Line Resist
Average Resist
Thickness
Resist Thickness
Range
Resist Thickness
Uniformity
Go back to the
top.
Back to the top
Back to the Microlab Home Page.
January 23, 1996
Process Monitoring Information
Tystar Process Monitoring
Lam Process Monitoring
CPA Process Monitoring
Photoresist Thickness Monitoring
Tystar Process Monitoring
Tystar9 MOS Clean Silicon Nitride (Si3N4) LPCVD Furnaces (4" and 6")
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Tylan 11, LPCVD Poly
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Resistivity
Tylan 12, LPCVD Oxide
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Dopant Concentration
Tylan 16, LPCVD Poly
Current Process Monitoring Results
.
Statistical Process Control graph for Deposition Rates
Tylan 18, LPCVD Low-Stress Nitride
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Film Stress
Tylan 20, LPCVD Oxide
Current Process Monitoring Results
Statistical Process Control graph for Deposition Rates
Statistical Process Control graph for Dopant Concentration
Get old process monitoring results
here
.
Go back to the
top.
Tylan Projects
The
Tylan 9 characterization project
was done to see what effects changes in the temperature, pressure, and gas flows would have on the deposition rate and uniformities.
The
Tylan 16 open/closed boat comparison
was performed to see what the consequence of using an open boat would be.
Go back to the
top.
Lam Process Monitoring
Current data for
Lam 1
, Nitride Plasma Etching.
Current data for
Lam 2
, Oxide Plasma Etching.
Current data for
Lam 3
, Aluminum Plasma Etching.
Current data for
Lam 4
, Poly-Silicon Plasma Etching.
Get old Lam results
here
.
Go back to the
top.
CPA Process Monitoring
Current data for the
CPA
Get old CPA results
here
Go back to the
top.
Photoresist Thickness Monitoring
Process Monitoring Graphs for OCG G-Line Resist
Average Resist
Thickness
Resist Thickness
Range
Resist Thickness
Uniformity
Process Monitoring Graphs for OCG I-Line Resist
Average Resist
Thickness
Resist Thickness
Range
Resist Thickness
Uniformity
Go back to the
top.
Back to the top
Back to the Microlab Home Page.
January 23, 1996